US Scientists Develop Copper Coating Heat Dissipation Technology & 740% Increase in Power

May 10, 2023

A team from the University of Illinois and the University of California, Berkeley in the United States has demonstrated a new cooling method that can effectively absorb heat from electronic devices, with a design power of 7.4 times that of traditional heat sinks operating within a given volume.
Heat is the great challenge for electronic product designers and be also one of the main limiting factors that hinder the miniaturization of electronic products. If the heat cannot be released from the circuit, they will malfunction functionally and sometimes physically.
Therefore, the heat sink is the main component of PC cooling technology. Both passive and active cooling use heat sinks and heat sinks. The common stacked chip shaped heat sinks are designed to transfer heat from sensitive areas and dissipate heat in areas that do not cause trouble, but they typically cannot dissipate heat from the bottom of the device because it generates a large amount of heat.
The next generation of radiators has been trying to improve traditional ones, but the team stated that they are usually made of expensive materials such as diamonds, and they typically cannot be directly installed on the surface of the components.

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